ROCH’s Thermal Shock Test Chamber has recently undergone a series of technology upgrades to reduce the overall test time and shorten the temperature recovery time while maintaining high uniformity. The result thus obtained shows consistent accuracy in temperature recovery and uniformity across multiple test cycles, thereby improving the chamber’s test reproducibility and reliability characteristics. Inside the chamber, the hot and cold zones are sealed with specially designed gaskets to minimize leakage between the two zones. The specially designed test basket of low thermal mass and a powerful temperature-conditioning unit enable the chamber to recover faster. The KTS series of the thermal shock chamber meets all of the major international test standards, such as MIL-883H, MIL-202G-107G, JESD22-A104D, IEC 60068-2-14, JASO D014-4, EIAJ ED-2531A, and JIS C 60068-2-14.
Thermal Shock Test Chamber Manufacturer
Features:
- A vertical-orientation Orientation Thermal Shock Chamber has two independently controlled hot and cold zones; one atop the other.
- A single product carrier moves between each zone, subjecting the product to dramatic changes in temperature.
- An advantage of the Vertical Orientation chamber is that it uses less floor space, making it ideal for smaller labs.
- A horizontal-orientation Orientation Thermal Shock Chamber has three side-by-side independent zones: hot, ambient, and cold.
- The addition of the ambient zone allows for three-zone testing, which is a requirement of some military standards.
- A double-duty thermal shock chamber has a cold zone positioned between two hot zones, aligned vertically on top and bottom.
- This design makes efficient use of the chamber cooling system, providing increased product testing throughput over standard thermal shock designs.
- Heaters are incorporated into the cold zone for defrost, allowing the zone to be operated as a temperature cycling chamber when it is not being used for thermal shock tests.
Thermal shock environment chamber testing is applied to products to observe their features and failures induced by multiple materials and their thermal expansion coefficients. The thermal shock test chamber involves feeding the chamber at alternating high and low temperatures. Also known as a temperature cycling chamber, the thermal shock chamber is used to test the long-term impact of a wide range of temperatures on a product’s or part’s quality parameters.
Thermal shock testing simulates the significant temperature variations that a product may see in real-world use by users. Consider the shock a smartphone battery gets when someone goes from chilly winter weather outside to the comfort of their own house. For example, imagine leaving an airport runway in 95°F weather and then reaching peak altitude in -40°F to -70°F temps. The Thermal Shock Test Chamber can also be customized per the test requirements.
Our Products
Thermal shock test chamber | Small Sized | Medium sized | |
ETS-50 | ETS-600 ETS-300 ETS-100 ETS-150 | ETS-900 | |
Test Basket Volume | 501 1 (1.7 cu.ft) | 1501(5.3cu.ft) 3001(10cu.ft) 1001 (3.5 cu.ft) 6001 (21 cu.ft) | 9001 (31 cu.ft) |
Test Basket load resistance | 15 kg | 50 kg 25 kg 75 kg 40 kg | 100 kg |
Basket movement Type | 2-Zone Vertical movement of specmen | 2-Zone Vertical/Horizontal movement of specmen | |
Basket movement mechanisum | Vibration free Pneumatic/Motorised mechanisum | ||
Basket Transition time | From Hot to Cold and Cold to Hot Zone <10 Sec. | ||
Performance | |||
High Temperature Range | High Temperature Working Range 70 deg C to 200 deg C /158 deg f to 392 deg f. | ||
Low Temperature Range | Low Temperature Working Range 0 deg C to -65 deg C /32 deg f to -85 deg f. | ||
Fluctuation | Temperature Fluctuation +/- 1 deg C | ||
Gradient | Gradient +/- 1 deg C. | Gradient +/- 1 deg c. Gradient +/- 1 .5deg C. Gradient +/- 1.5 deg C. Gradient +/- 1 deg c. | Gradient +/- 2 deg c. |
High Temperature Range | Pre-Heating upper limit 210 deg /410 deg f | ||
Temperature Heating Time | Ambient Temperature to 210 deg C with in 40 Min. | ||
Fluctuation | Temperature Fluctuation +/- 1 deg C. | ||
Low Temperature Range | Pre-Cooling Lower limit -75 deg C /-103 deg f | ||
Temperature Cooling Time | Ambient Temperature to -75 deg C with in 35 Min. | ||
Fluctuation | Temperature Fluctuation +/- 1 deg C | ||
Basket Recovery time | Basket Temperature recovery time will be <5 Min at 200 deg C and -65 deg C | ||
Hot Zone | Hot Zone recovery time will be 120 Min from 200 to 70 deg C with out load. | ||
Cold Zone | Cold Zone recovery time will be 60 Min from -65 to 25 deg C with out load. | ||
Dimensions | |||
Basket dimensions | W 500mm | W 900 mm W 600 mm W 500 mm W 800mm | W 1000 mm |
D350mm | D 750 mm D 500mm D 500 mm D 900 mm | D 1000 mm | |
H 300mm | H 500mm H 750 mm H 400 mm H 500 mm | H 900 mm | |
External dimensions | W 950mm | W 950mm W 1050mm W1250mm W1350mm | W1450mm |
D 1950mm | D 2100mm D 2100mm D 2500mm 2350mm | 2700mm | |
H 1550+500mm | H 1700+700mm H 1650+600mm H 2150+950mm H 11700+700mm | H 2400+1100mm |
ROCH Mechatronics Inc. is a leading manufacturer, supplier, and exporter of high-quality thermal shock test chambers, offering reliable solutions for thermal shock testing across various industries. Our thermal shock chambers are designed to meet stringent standards, ensuring precision in temperature shock test processes. Whether you’re looking for an air to air thermal shock chamber or a liquid to liquid thermal shock testing machine, we have the right equipment. Our thermal shock environmental chambers are ideal for testing the durability of materials. For inquiries about thermal shock chamber price, contact ROCH Mechatronics Inc., your trusted partner for thermal shock test equipment and shock chamber solutions.
A Thermal Shock Chamber is a specialized environmental testing device designed to subject products and materials to extreme and rapid temperature changes, simulating conditions they might experience in the real world.
These chambers are used to assess how products and materials respond to sudden temperature transitions, helping identify potential defects, weaknesses, or failures under extreme thermal conditions.
Thermal Shock Chambers are widely used in industries such as electronics, automotive, aerospace, defense, and telecommunications to test products like semiconductors, electronic components, and materials used in harsh environments.
These chambers can perform tests like hot-to-cold thermal shock tests, cold-to-hot thermal shock tests, and temperature cycling tests to evaluate a product’s ability to withstand rapid temperature changes.
Thermal Shock Chambers use controlled heating and cooling systems to create rapid temperature transitions. The product is moved between hot and cold zones to induce thermal stress.
Some chambers can simulate high-altitude conditions by controlling not only temperature but also air pressure, making them suitable for altitude-related testing.